Some vehicles can have nearly 40 different harnesses to connect all the ICs. Like so much of the semiconductor industry, the automotive industry is now turning towards 3D-IC design techniques to help ...
Current near-term challenges being addressed by the OCP Community include developing advanced 3D-IC design kits that ...
Joins the first wave of new semiconductor transistor architecture developmentTaipei, Taiwan, Nov. 05, 2024 (GLOBE NEWSWIRE) - ...
TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for ...
TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute ...
The purpose is to demonstrate the feasibility of 3D IC architecture for SoC design. The partitioning scheme is done manually at block level where USB controller, H.264 encoder block with its local ...
Abstract: In this paper, a deep reinforcement learning (DRL) approach that optimizes the power/ground ball map design within the ball grid array (BGA) package of 3D-ICs considering ...
TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
"The awards celebrate OIP partners like Ansys who strive for excellence in design enablement, working closely with TSMC to accelerate advanced 3D IC design for the next generation of AI innovation." ...
Cadence excels at providing the necessary IP and the tools to offer comprehensive 3D-IC design solutions, such as the Cadence Integrity 3D-IC Platform. Going forward, designing for packaging, ...
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