A new technical paper titled “TA3D: Timing-Aware 3D IC Partitioning and Placement by Optimizing the ... solution to overcome the constraints of traditional 2D Integrated Circuits (ICs). Recent ...

2.5D and 3D integrated circuits (3D ICs) have emerged as a transformative technology. 2.5D layouts connect multiple die on an interposer; 3D IC designs stack multiple layers of chiplets ...

Controlling interference in today’s SoCs and advanced packaging requires a combination of innovative techniques, but new ...

Additive manufacturing (AM), otherwise known as 3D printing, is an incredible process that creates three-dimensional, ...

HANGZHOU, China, Sept. 18, 2024 (GLOBE NEWSWIRE) -- Nano Labs Ltd (Nasdaq: NA) (“we,” the “Company” or “Nano Labs”), a leading fabless integrated circuit design company and product solution provider ...

A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention than the others ...

WILSONVILLE, Ore., May 23 -- Mentor Graphics Corporation today announced the availability of Design Architect-IC(TM), a powerful and easy-to-use design capture tool. Design Architect-IC helps to ...

Taiwan Semiconductor Manufacturing Company Limited is the world's largest dedicated integrated circuit foundry. As a foundry, TSM manufactures ICs for its customers based on their proprietary IC ...

Samsung has announced the next evolution of its Odyssey gaming monitor lineup by adding glasses-free 3D technology. The Samsung ‘Odyssey 3D’ as it’s so aptly named, does just what it says by ...