Some vehicles can have nearly 40 different harnesses to connect all the ICs. Like so much of the semiconductor industry, the automotive industry is now turning towards 3D-IC design techniques to help ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...

supports customers with chip design projects. Recently, Faraday announced a 2.5D/3D-IC advanced package service to address exploding demand for multi-die designs that target products with better ...

As demand for smaller, more power efficient and higher performing ICs continues to challenge the global IC design community, next-generation devices increasingly feature complex 2.5D and 3D ...

25, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider ...

Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for ...

Taiwan's IC design houses are anticipating a sluggish fourth quarter in 2024 but remain hopeful for a rebound in 2025, driven by increased demand in sectors such as PCs, network communications,..

Cadence.AI is a chips-to-systems AI platform spanning all aspects of design and verification. The collaboration between TSMC and Cadence is focused on three main domains: Multiphysics analyses and ...

Current near-term challenges being addressed by the OCP Community include developing advanced 3D-IC design kits that ...

Adding RaptorX into the design flow will enable Faraday to increase precision and efficiency in its development process. Moreover, it enables predictively accurate EM modeling and analysis for ...

Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute ...